Optoelectronics Device Characterization Laboratory
Optoelectronics Simulation Laboratory
Optoelectronic Packaging Laboratory
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Southern Methodist University |
| School of Engineering | |
| Link to Dallas LEOS Section | Department of Electrical Engineering |
Optoelectronic Packaging Laboratory
The Optoelectronic Packaging Laboratory is equipped with a die-attach, ultra and thermo sonic wedge and ball bonders, a vacuum thermal evaporator system, and a various high precision laser-chip mounting fixtures for edge and surface emitting lasers. Indium (In) or Au/Sn solder is used for die attach. Click here to see pictures of the equipments in the Optoelectronic Packaging Laboratory.